1. 2. 3. material content data sheet sales product name bas 116 e6327 issued 29. august 2013 ma# MA000503740 package pg-sot23-3-11 weight* 8.79 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip noble metal gold 7440-57-5 0.003 0.03 341 inorganic material silicon 7440-21-3 0.026 0.29 0.32 2912 3253 leadframe non noble metal chromium 7440-47-3 0.008 0.09 927 inorganic material silicon 7440-21-3 0.001 0.01 62 non noble metal titanium 7440-32-6 0.003 0.03 309 non noble metal copper 7440-50-8 2.704 30.76 30.89 307573 308871 wire noble metal gold 7440-57-5 0.007 0.08 0.08 760 760 encapsulation organic material carbon black 1333-86-4 0.058 0.66 6589 plastics brominated resin - 0.087 0.99 9884 inorganic material antimonytrioxide 1309-64-4 0.116 1.32 13179 plastics epoxy resin - 1.246 14.17 141672 inorganic material silicondioxide 60676-86-0 4.287 48.75 65.89 487617 658941 leadfinish non noble metal tin 7440-31-5 0.150 1.70 1.70 17020 17020 plating noble metal silver 7440-22-4 0.098 1.12 1.12 11155 11155 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
|
